KINGSTON HyperX Impact 8GB SoDIMM DDR3L 1600Mhz 135 Low Voltage - HX316LS9IB/8

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HX316LS9IB/8
8GB 1G x 64-Bit DDR3L-1600
CL9 204-Pin SODIMM

DESCRIPTION
HyperX HX316LS9IB/8 is a 1G x 64-bit (8GB) DDR3L-1600 CL9
SDRAM (Synchronous DRAM) 2Rx8, low voltage, memory
module, based on sixteen 512M x 8-bit DDR3 FBGA components.
This module has been tested to run at DDR3L-1600 at a
low latency timing of 9-9-9 at 1.35V or 1.5V. Additional timing
parameters are shown in the PnP Timing Parameters section
below. The JEDEC standard electrical and mechanical specifications
are as follows:
Document No. 4807048-001.A00 05/20/14 Page 1
SPECIFICATIONS
CL(IDD) 9 cycles
Row Cycle Time (tRCmin) 48.125ns (min.)
Refresh to Active/Refresh 260ns (min.)
Command Time (tRFCmin)
Row Active Time (tRASmin) 33.75ns (min.)
Maximum Operating Power TBD W* @1.35V
UL Rating 94 V - 0
Operating Temperature 0o
C to 85o C
Storage Temperature -55o
C to +100o C
*Power will vary depending on the SDRAM used.
HX316LS9IB/8
8GB 1G x 64-Bit DDR3L-1600
CL9 204-Pin SODIMM
Continued >>
kingston.com/hyperx
PnP JEDEC TIMING PARAMETERS:
• DDR3-1600 CL9-9-9 @1.35V or 1.5V
• DDR3-1333 CL8-8-8 @1.35V or 1.5V
• DDR3-1066 CL6-6-6 @1.35V or 1.5V
Note: The PnP feature offers a range of speed and timing options to support
the widest variety of processors and chipsets. Your maximum speed will
be determined by your BIOS.
HX318C10FB/4
FEATURES
• JEDEC standard 1.35V (1.28V ~ 1.45V) and 1.5V (1.425V ~
1.575V) Power Supply
• VDDQ = 1.35V (1.28V ~ 1.45V) and 1.5V (1.425V ~ 1.575V)
• 800MHz fCK for 1600Mb/sec/pin
• 8 independent internal bank
• Programmable CAS Latency: 11, 10, 9, 8, 7, 6
• Programmable Additive Latency: 0, CL - 2, or CL - 1 clock
• 8-bit pre-fetch
• Burst Length: 8 (Interleave without any limit, sequential with
starting address “000” only), 4 with tCCD = 4 which does not
allow seamless read or write [either on the fly using A12 or
MRS]
• Bi-directional Differential Data Strobe
• Internal(self) calibration : Internal self calibration through ZQ
pin (RZQ : 240 ohm ± 1%)
• On Die Termination using ODT pin
• Average Refresh Period 7.8us at lower than TCASE 85°C,
3.9us at 85°C < TCASE < 95°C
• Asynchronous Reset
• PCB : Height 1.180” (30.00mm), double sided component

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